Define “cold solder joint” according to IPC-A-610.

The definition of a "cold solder joint" according to IPC-A-610 is that it is a solder joint that lacks proper heating, which often leads to a poor electrical connection. This occurs when the solder does not reach the appropriate temperature necessary for adequate flow and adhesion to the surfaces being joined. When a joint cools too quickly or is not heated sufficiently, the solder will not bond properly, creating a weak connection that may fail during use.

A cold solder joint typically exhibits characteristics such as a dull or grainy appearance and may appear to have unsatisfactory wetting of the components. It is crucial for solder joints to reach the right temperature to ensure that the solder melts correctly and flows into the joint, creating a reliable electrical and mechanical connection. Understanding this characteristic of cold solder joints is essential for achieving quality in electronic assembly processes.