What defect type is considered a “solder splash” in IPC-A-610?

The defect type classified as a “solder splash” in IPC-A-610 refers to uncontrolled solder that inadvertently deposits on surfaces. This occurs when solder is unintentionally splattered or dropped during the soldering process, resulting in small beads or droplets of solder that are not part of a proper joint. These extraneous deposits can cause issues such as electrical shorts, physical interference with components, and overall aesthetic concerns regarding the quality of the printed circuit board (PCB).

This understanding centers around the importance of controlled solder application, which ensures that solder is only used where it is needed for reliable electrical connections. Solder splash represents a lack of control in the soldering process, potentially leading to functional and cosmetic defects on the assembly. Hence, recognizing this defect type is crucial for maintaining compliance with IPC-A-610 standards and ensuring high-quality electronic assemblies.