What is a "void" in solder joints per IPC-A-610?

A "void" in solder joints, as defined by IPC-A-610, refers to an air pocket that is trapped within the solder material. This can be a critical issue since it compromises the integrity and reliability of the electrical connection. Voids can prevent optimal electrical conductivity and thermal transfer, both of which are vital for the performance and longevity of electronic assemblies.

When a void occurs, it may result from inadequate solder filling during the assembly process, which can happen due to various factors, such as improper soldering techniques or insufficient heat application. Over time, the presence of these voids can lead to increased resistance, overheating, and ultimately, failure of the assembly. Therefore, understanding and identifying voids is essential for ensuring the overall quality and reliability of solder joints in electronic manufacturing.