Which of the following issues can arise from intermittent connectivity in solder joints?

Intermittent connectivity in solder joints can lead to a significant loss of signal integrity. This occurs because the electrical path is not consistent, causing disruptions in the signal transmission. When there are weak or unreliable connections within the solder joints, the signal may experience fluctuations, leading to errors, noise, or complete failure in the circuit operations. This is particularly critical in high-frequency applications or sensitive electronic devices where stable signal transmission is essential for proper functionality.

Other issues associated with intermittent connectivity, like increased heat resistance or reduced electrical efficiency, may not be directly tied to the core problem of signal integrity. While it could be argued that poor connections might contribute to higher resistance in some instances, the primary and most immediate concern when discussing intermittent connectivity specifically relates to the integrity of signals being transmitted through those joints. Therefore, loss of signal integrity is the most relevant and impactful issue arising from such conditions.